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date 28-jan-99 i. these techincal literature include materials protected under &he copyright of sharp corporation (?s?ha@). piease do not reproduce or cause anyone to reproduce them without sharp?s consent. 2. when using this product, please observe the absolut: maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting ficm use of the product which dces not comply with the absolute maxirn~m ratings md the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the fouowing application areas; i 7 l 0.4 equipment * audio visual equipment * home appliance + telecommunication equipment (terminal) l measuring equipment * tooling machines * compulers i if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (z), please be sue to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when &is product is used for equipment which demands high reliability and safety in function and precision, such as ; r l transportation control and safety equipment (aircraf?, aain, automobile etc.) - 1 * traffic sign& * gas leakage sensor breakers l rescue and security equipment l l other safety equipment _i (3) please do not use this product for equipment which require exnemeiy high rehability and safety in function and precision, such 5s ; r l space equipment l * telecommunication equipment (for trunk lines) ? nuclear power control equipment * hfedical equipment 1 (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. ** the technical literature is subject to be changed without notice ** opto-electronic devices division electronic components group sh.afw corf?oration
gmsin95200a technical wrature 1. applicxian thi.~ technicat litemure appk to the light en&kg diode device mo&i no. gm5wt952ooa 1 chip type white led (gan chip led device) dg-991015 1 jan/t8/99 mod& nj. g?viswt95200a 17 page l/13 2. outline dimensions and terminal co~uxc~~ocs ..,.................~.refertotheanachedsheetpage2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . ..?.......... refer to the attached sheet page 3-5 3-1. absolute maximum ratings 3-2. electra characteristics 3-3. optical characteristics 3-1. ltious intensity rank 3-j. color coordinates ranks 3-6. derating curve 3-7. characteristics chart 4. reliability ..,,...............i......... --.--..-.-.-...-.-......refertotheattachedsheetpage6. 4- 1. test items and test conditions 4-2. failure judgement criteria 5. incomin_e inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 7. 5-1. inspection method 5-2. description of inspection and criteria 6. taping specification ..,........*,.................,...........*. refer to the attached sheet page 8-i 1. 6-i. taping 6-2. label 6-3. dampproof package 7. soldc.+g . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 12. 7-1. reflow solderins 7-2.mylual soldering 7-3. dip soldering method 8. precsutions for use . . . . . . . . . a. . . . . . . . . . -.......-.g...o.....,-..irefer to &e attached beet page 13. 8-l. precautions maners for designing circuit 8-2. cleaning method 9. environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~.................... refer to the attached shett page 13. 9-i. ozonosphere destructive chemicals. 9-2. brornic non-burning materials
dg-991015 1 jan/21iii%- imodel x-a. ) page - gm5wt352oox i - 2j13 n 1 ?oic. . it is not 2. outline dimensions and terminal connections aa . p f- . ~thade mark ! i i 3-l -p+- \ ? i 6 .,-.i __-- j _-_-- l,-- -- ikl i ---- -- 1 --------- ql /i-? !.i i.2 0 anode / @ cathode / include the flash in this dimension. 2. pin connection 0 anode @ cathode lo t- d 3. unspecified tolerance to be k0.2 unit scale applicable model rhwhg no. bib free gbt5w-r95?00a 51101014
c . ..-..-- ? . . .? ..?-- . - 3. raiogs and charac:erktics -- _ e-1-- _, -- .- .- ? .y- ? : ;. _, . . i .?; -; ?l . . . ,- . 3- 1. ahsolute maximum ratings p3rameter power dissipation continuous fonvard current peak forward current @ore 1) dcrating factor (syabol t 1 p i --~ if 30 illa hl 50 lll4 dc - 0.10 t&4x pulse i - 0.67 ida/t reverse voltage va 5 1 v operating tempenture 1 topr 1 40 to +100 ( ?c storage temperature 1 tstg 1 40 to cl00 1 oc soldering temperature @ate 2) 1 tsol 1 295 1 ?c (hotel) duty ratio=1/10,pulse width+.lms (note?) manual soldering max3second 3-2. elec&o characteristics (ta=ts?c) , parameter /symbol1 conditions 1 min. lyp. 1 hf.4x. 1 lhit forward voltage vf i&omt\ 1 - 3.8 1 4.5 1 v reverse current 1s vr=4v w 1 100 i pa 1 3-3. optid characteristics ta=t5?c) - i- 7 luminous model no. condition intensity ?3 luminous intensity ra& color coordinates ranks iv(mcd)typ. -- gmswt%?ooa if=20mx 200 g(h?(i(j oiplq (notes)ueasured by sharp egbg models50 (radiometerflhotoneterswem) 3d.luminous intensity rank , rank : luminous intensity /rank : luminous intensity 1 unit b : 4.8 - 9.2 j e : 43 - 84 a : 6.9 - 13.2 / f : 62 - 121 a : 10 - 19 mcd 8 : 14 - 28 i ; i 1;; - 174 - 250 c : 21 - 40 i i : 185 - 360 d : 30 - ;a 1 j : 266 - 518 olerance: 215%
dg-991015 jaw28199 .uodel no. j p.g- gilf5w95200a ? 4/13 ?- 3 .;- . , - . . . -. - .- .-1. c-- .- _- :.= i? ., 3-s.color coordilares ranks ?\ : .: rank : color coordinstes rank x i y 0 0.26 - 0.32 1 0.2 - 0. 38 p 0.3 - 0.36 i 0.22 - 0. 40 0 0.34 - 0.40 ? 0.26 - 0.44 s-6. derating curve peak forward currenr daating cum -40 -20 0 20 40 60 80 100 120 ambittnr tcmpraturc t$c) pelk forward current vs. dub ratiofla=2%) - l/lw l/10 l/1 duty ratio dr 60 fotward current dcrafing curve -40 -20 0 20 40 60 80 100 120 ambitcnt tanpraturo tat%) (note above charxteristic data are t)-pical km and not . gurvlted data - -
relative luminous intesity vs. fommd cm t.tapt5q loook 1% 0. 0. i 1 10 too 1 2 3 4 5 forward current i&4) forward voltage v,zo fonvard cumt vs. forward vduge (~~25?~ : 3-7. characmistics chart dg-991015 i mcdei. ya gmswt952ooa sad2889 _ pacz 5113 - . . . . ; .?i ..?,i, . i i?; .. ?. . (?. .c . g i i_...- * - -;*-.- - _ - .? w. - . . n [aote)above charxteristic data are typical data and not gumted dam. w-r95 _
dg-99lou jagg hfodes no. page gsi5i-gt95200.a 6113 4. rcliabiliry the rcliabtity ofptoducrs shall be satisfied with items listed below. 4-1. test items and :es concliricns r test items test conditions confidence level: 90% s~plcs temperature cycling -to~c(jomin)~+1oot(3omin),lcocy n=22, c4 10 hieh temp? and ?@ humidicy storage tazt6$c, nkrk, pi00oh n=22,c=4 10 high temperature ta=(tng-maximum ratings),r-1030h n=22, c-0 10 storage low temper3rure storage ta=(tstg-minimun ratings),r iocoh n=22,c=tl io i opcratig test i ta=25?c,ie(if-maximum ratings),~loooh ~n=22,c=q 10 kfechtical shock 15 000m/s',0.5ms,3timesj~x,iy~zdirection n=ll,c=o 20 vtiabte frequency vibration zoomis', 100-2 ooo-100wsweepfor zomin.,4times/yy,z direction n=i 1, c-0 z? soldering heat refer to the attached sheetgage 12?13 1 time n=ll,c=o 20 5-2. failure judgemeat criteria (sotel) parameter symbol fail judgement criteria (noted) r forward voltage vf v,> u.s.l. x i.2 reverse cuneat ir i,> u.s.l. ' 2.0 luminous intensity iv iv > the first stage value x 1.5 or the jirst stage value x 0.5 > iv fiote i)mcasuring conditioa is in accordance with specification. (note2)u.s.l. is shown by upper specification limit.
5. hcoming insptc5on 5-i. lrq-mion method a single sampling pla normal inspection level ii based on is0 2859-i shail be adopted - -. ?m.*y.wu ?i yuyb?la?y yuy .ai..?a? no. inspection items criteria 1 openhon no light emission 2 radiation color not cmreicl 3 taping product inserted in reverse direction 4 label model number is not printed,or misprinted 5 electro-opcical characteristics not conforming to the specification 6 outline dimensions not conforming to the specifhion 7 dust and flaw effect to the specification -..-. - 8 resin ff ash 0.3mm or greater &om the product defect aql gg 0.1% dg-991015 i jaans model so. 1 page
dg-991015 janf2??i99 model no. p?rge gmswi95200x a13 6. taping 61 taping 6-i-lshape and dimension of tapc(typ.) parameter 1 symbol ldimension remarks 1 thickness 1 t , 0.3 i thickness of the entire tit 1 tt 1 2.3 (with cover tape and carrier tape combined % mated : carrier titpe...ps, cover tape...polyestcr
dg-991015 model no. i gmsw95200x 1 9113 6-i-t.shape and dimension of reel(lyp frange parameter 1 symbol] dimension 1 remarks i diameter thickness inner mace direction extf rmm--.) a d i78 t 1.5 w io dimensinn of shaft core i 1 s q&o 1 - --_--- ---- -- emal diameter hub soindle hole diameter i c d13 t i t i key slit f width 1 e t r-- 2.0 i i i i depth ) u t 4.5 i jotation for part name etc. (labeling on one side of flange.@art name,quantity,iot no.) % material : reel...polystyrene
dg-991015 model no. GM5WT95200A sanra/99 page 10113 6-i-3.taping specification (1) lead tape: end ~~11 out i-> bigining 10 plch or mare stuffed empty leading 10 pfi;h or nore ' 40-50 pith (2) cover tape stxngth against peejing:f=o. 148n( 6 =lo?or less) cover taue uuuuuuuduuuu tape speed : 5mm/s w forward (3) tape strength against bending: carrier tape the rndius ofbendiug circle should be 30mm or more. lfit is less than 3omm the cover may peel. (4) jointing of tape: there should not be joint of cover tape or carrier tape. (5) quantity per reel: average 2,ooopcs. per reel (6) product wcighr approx. 0.03 g (7) others: 0 ap parent defect of product ahorrid not be packed and product should not upset. 0 there should not be missing above continuous three products. @ products should be easily taken out. @ products should not be aaached to the cover tape at peeling. 6-2. label for reel c~ljwr9s20m qua.ty 2000 - model number lot number *--r lot no. kwbhoi - luminous rank and dominant waveiength rank -=eiaj c-3> we m japan + production country * :lot number indication 0 production plant code(to be indicated alphabetically) @ production iot(single or double figures) 0 year of productioa(tbe last two figures of the year) @ month of production (to be indicated alphabeticaily with januuy corresponding to a) 0 date of producdon(01 - 3 1)
r do-9910 15 jww99 modelno. pagz gwwr952oox 11113 6-3. dampproof package in other to avoid the absorption of humidir)i h tnnspo~ and storage. the devices are packed in ahxninum sleeve. label 6-el.strage conditions temperature : 5 to 30c humidity : less than 6o%rh 6-3-2.treatment after opening (1) please make a soldering within 2 days ah opening under following condition; tempezmre : 5 co 30c humidity : less than 6o%rh (2) in case the devices are not used for a long he after opening .the storage in dry box is recommendable. or it is better to repack he devices with a desicative by the sealer and put them in the some storage conditions as 7-3- 1. then they should k ?sed within 2 days. (3) please make a soldering afier a following h&king treatmeat if unused term should be over the conditions of (2) reconunenclable conditions: 0 in taping temprature:6o?c to 65?c,time:36 to as hours q in individual (on pwl3 or metallic tray) tempmture: 100c ,time:2 to 3 houn
gm5%-i95200a 1 1203 7. soldering 7-iredow soldeiiq (1) it is not rc=ornmended to exceed the soidering temperarum and time ~iowu below. caused by subsnare bend or the other mechanical stress &.ng reflow soldering may happen gold wire disconnection etc. therefore please check and study your solder reflow machine?s best condition. (2) reflow soldering temperamre prome to be done under the following condition. to be done under the following condition. max 250 time (s) recommendable thermal model (4) rccommcndable metal mask pattern for slxen print recommend o.tmm to 03mm thickness metal mask for screen print. caused by solder reflow condition, solder paste, substrate and the other martial etc., my change solderbility. center of the product please check and study actual solderbihry before usage. 7-2.manual soldering recommended solder pattern (1) it ia recommended to keep the soldering iron temperature at 295x (soldering iron power ccnsumption 2ow> and not to solder more than once or for over 3 seconds. (2) when using a soldering iron, care must be taken not to damage the package. (pay attention not to allow any under stress or heat on package.) 7-3. dip soldering method to be done under the following condition. re-heat temp. : 80 to 120 ?c time : 30 to 120 seconds soldering temp. : max. 260% time : within 5 seconds
8. precautions for use 8-1. precautions matters for designing circuit (l)this product is not designed as electromagnetic and ionized-particle diari~n resistant uthis led device applies blue led & borescent mattrial to emit white &ht. therefore, dependhrg on the vatue of operation current, tone of the color may channp slightly. please check the tone under actual usage condition in advance. 8-2. cleaning method (1) solvent cleaning recommend conditions: 0 solvent temperature is not more than 45 ?c. @ immersion up to 3 &mites. (2) ultrasonic cieaning the affect on the device from ultrasonic bath, uibasonic output, duration, board size and device mounting method. test the cleaning method under actual conditions and cheek for abnotmahties before aotual use. (3) soivenb use only the foliowing types of solvent. water, alcoho1, chiorofluorocabon-based solvent when c!eaning is necessary. recommend conditions: rt. 40khz, 3ow/l, 3 to 5 minutes 9. environrnenr 9-i. ozonosphere destructive chemicals. (i) the device doesn?t contain following substance. (2) the device doesn?t have a production line whose process requires foilowing substance. restricted part: cfca,haiones,cci~,ttichioroethane.(methychiorofotm) 9-z. bm& non-burning materials the device doesn?t contain bromic non-burning materisis(pbbos,pbbs)

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